Superspeed USB or USB 3.0

Intel unveils the draft specification of its xHCI (eXtensible Host Controller Interface) for USB 3.0. The xHCI draft specification describes the register-level host controller interface for Universal Serial Bus (USB) Revision 2.0 and above. The specification includes a description of the hardware/software interface between system software and the host controller hardware.

This specification is intended for hardware component designers, system builders and device driver (software) developers. Specs can be checked at the link http://www.intel.com/technology/usb/spec.htm.

For the end users what does it means ? If we go along with the promoter group (Microsoft, Intel, Texas Instrument, HP, NEC, NXP) of the USB 3.0 then it means a SuperSpeed USB personal interconnect that can deliver over 10 times the speed of today’s connection. The technology will target fast sync-and-go transfer applications in the PC, consumer and mobile segments that are necessary as digital media become ubiquitous and file sizes increase up to and beyond 25 Gigabytes. USB (Universal Serial Bus) 3.0 will create a backward-compatible standard with the same ease-of-use and plug and play capabilities of previous USB technologies. Targeting over 10x performance increase, the technology will draw from the same architecture of wired USB. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency.

gPhone aka Google Phone aka HTC Dream

Long awaited and rumored Google phone aka gPhone aka HTC Dream has been approved by FCC. It is said to be in compliance with Bluetooth 2.0 + EDR with this round of testing conducted only on the GSM/GPRS/EDGE 850/1900 and WCDMA 1700 bands.

If indeed this is the long awaited Android phone, then T-Mobile, HTC, and Google are free to announce in September with an October launch as originally planned.

Meanwhile Google has announced new version of Android version 0.9 the Mobile OS, so the devices will be reality soon.

Sony T700 and T77 Digital Cameras

Sony has introduced a stylish range of Cyber-shot(R) DSC-T700 and DSC-T77 digital cameras with "intelligent" shooting functions.

The T77 is Sony's thinnest model at less than 5/8 of an inch. It sports a 3-inch, 16 x 9 touch panel LCD screen. The features updated intelligent scene recognition technology, Smile Shutter(TM) and face detection technologies with child and adult priority, as well as high sensitivity shooting (up to ISO 3200), eleven scene modes, and in-camera image management.

The other model T700 model can feature as album in pocket. It has all the features of the T77 plus 4GB of internal memory that can store nearly 1,000 full-resolution or 40,000 VGA-quality photos; a 3.5-inch, wide touch panel Xtra Fine LCD(TM) screen for photo-like viewing (210 pixel-per-inch resolution) with high contrast and wide-angle viewing; and a thin profile (slightly more than 5/8 of an inch) so it can easily slip into a pocket or purse.

Both the models feature a newly developed Carl Zeiss(R) lens that integrates a 4x optical zoom and Optical SteadyShot(TM) image stabilization, yet achieves a slim form factor. They will also be available in a wider selection of color options than previous T-series cameras.

The DSC-T77 replaces the former T70 model and will be available in brown, green, pink, black and silver in late September for about $300. The new DSC-T700 cameras ships at the same time in red, champagne gold, pink, dark gray and silver for about $400.